Broadcom Corporation (NASDAQ:BRCM) is undervalued given its solid core business and the optionality in Mobile. The company's platform-driven approach in Broadband/Networking and its initial LTE traction puts the semiconductor firm in good shape for 2014.
The company continues to target growth in excess of its peers by leveraging its leading position with tier-1 customers and complete platform solutions in its Broadband and Networking Infrastructure segment.
Broadcom's strategy in Wireless is to apply its platform-driven approach to the Connectivity and Baseband end-markets. The company believes this enable higher Broadcom content per box and offer integrated turn-key solutions to a broader set of customers, including tier-2/3 OEMs in emerging countries.
[Related -Is Intel (INTC) About To Buy One Of These Companies?]
Top Paper Companies To Watch In Right Now: Micron Technology Inc.(MU)
Micron Technology, Inc., together with its subsidiaries, engages in the manufacture and marketing of semiconductor devices worldwide. Its products include dynamic random access memory (DRAM) products that provide data storage and retrieval, which include DDR2 and DDR3; and other specialty DRAM memory products, including DDR, SDRAM, DDR and DDR2 mobile low power DRAM, pseudo-static RAM, and reduced latency DRAM. The company also offers NAND flash memory products, which are electrically re-writeable and non-volatile semiconductor devices that retain content when power is turned off. In addition, it provides NOR flash memory products that are electrically re-writeable and non-volatile semiconductor memory devices; phase change memory products; and image sensor products. Micron Technology?s products are used in a range of electronic applications, including personal computers, workstations, network servers, mobile phones, flash memory cards, USB storage devices, digital still c ameras, MP3/4 players, and in automotive applications. It sells its products to original equipment manufacturers and retailers through internal sales force, independent sales representatives, and distributors, as well as through a Web-based customer direct sales channel. The company was founded in 1978 and is headquartered in Boise, Idaho.
Advisors' Opinion:- [By Rex Crum]
With Netflix leading the way, most of the rest of the tech sector also rose. Gains came from Facebook Inc. (FB) , Pandora Media Inc. (P) , Microsoft Corp. (MSFT) �and Micron Technology Inc. (MU) .
- [By Wallace Witkowski]
Micron (MU) �shares jumped 5.9% to $23.03 on heavy volume after reporting adjusted fiscal first-quarter earnings of 77 cents a share on revenue of $4.04 billion. A consensus of analysts polled by FactSet expected 44 cents a share on revenue of $3.72 billion.
Best Semiconductor Stocks To Buy For 2014: Camtek Ltd (CAMT)
Camtek Ltd. (Camtek), incorporated in 1987, designs, develops, manufactures and markets automated solutions dedicated for enhancing production processes and yield for the semiconductor manufacturing and packaging and the printed circuit board (PCB) and integrated circuit (IC) substrate industries. Camtek also designs, develops, manufactures and markets automated optical inspection (AOI), systems and related products. The Company�� AOI systems are used to enhance both production processes and yields for manufacturers in the semiconductor manufacturing and packaging industry and PCB and IC Substrate industry. Through the acquisition of Printar's assets, it also engaged in developing, manufacturing, sale and marketing of direct digital material deposition systems and inks for the PCB industry, with two major fields of activity: Solder Mask and Legend. In addition, through the acquisition of Sela, it is also engaged in the development, manufacturing and marketing of automated scanning electron microscope (SEM) and transmission electron microscope (TEM) sample preparation equipment, primarily for the semiconductor industry.
As of December 31, 2011, the Company had sold more than 2,500 AOI systems in 34 countries worldwide. The Company's PCB customer base includes the majority of the 100 PCB manufacturers worldwide. As of December 31, 2011, it had sold over 300 Falcon systems to more than 25 semiconductor manufacturers, among them outsourced semiconductor assembly and test (OSAT), integrated device manufacturers (IDM) and wafer level packaging subcontractors, including eight out of the top 10 semiconductors companies.
Camtek�� AOI systems consist of an electro-optical assembly unit, either movable or fixed, which consists of a video camera, precision optics and illumination sources. The electro-optical unit captures the image of the inspected product; a precise, either movable or fixed table, that holds the inspected product, and an electronic hardware unit, which operates the! entire system and includes embedded components that process and analyze the captured image by using its algorithms. Its systems can also compile and communicate statistical reports of inspection findings through the customer�� factory information system. The Company offers a range of systems for automated optical inspection of semiconductor wafers, IC substrates and PCBs. These systems are used to enhance production yields and assist in controlling manufacturing processes at wafer fabrication, test and assembly houses, and PCB plants worldwide.
The Company�� Falcon systems are designed for the back end market of the semiconductor industry. The Falcon�� advanced algorithms and inspection capabilities enable its dedicated models to detect defects in the die, which, if left undetected, may cause failure. The Condor is designed to meet the current and future inspection needs of the semiconductor industry. The Condor, through algorithms and advanced hardware configuration, is designed to enhance two dimensional (2D) and three dimensional (3D) detection abilities and increased throughput. The Condor family includes models for: 3D and 2D metrology and inspection of bumped-wafer prepared for packaging in the flip-chip technology; 2D metrology and inspection of finished wafers at the end of their manufacturing process and in test houses; Post-dicing inspection of frame-mounted wafers at assembly and packaging facilities, where it adds the value of detecting dicing-related damage, and inspection and metrology of micro-electro mechanical systems (MEMS) and other special applications.
Condor 5LED is an AOI system designed to provide solutions to a range of requirements that are to light emitting diode (LED) semiconductor manufacturers. The LED market�� special inspection requirements are characterized by 3-6 inch wafers, each of which may contain between 100 to over 200 thousand LED devices per wafer. Typically, the wafer is made of a translucent compound semiconductor, such as g! allium ar! senide, gallium phosphide and/or indium phosphide. The Gannet system is designed for the front end market of the semiconductor industry.
The Company�� AOI products for this industry consist of five product lines: the Phoenix, Dragon and Orion for the inspection of inner and outer layers of PCB panels and ultra-fine-line IC substrate; large area masks (LAM) dedicated for inspection of artwork; and the Pegasus for final inspection (AFI) of IC substrates and high density interconnect (HDI) panels. The Phoenix product family, introduced in November 2011, is designed to support a range of the demanding PCB and IC substrate applications, while keeping in pace with the dynamic technology changes in the industry. The Phoenix product family is enhanced with Spark - Camtek's and detection engine providing high detection capabilities, while minimizing false calls.
Dragon systems are high-throughput, automation-ready systems for inspection of all PCB types in a mass production environment. Dragon models are optimized for specific PCB technology ranges - from mainstream circuits of typically 100 (microns) conductor line width, up to high density substrates having 12 (microns) wide conductive lines. All Dragon models are designed to interface with automated material handling mechanisms provided by the Company or other automation suppliers. Orion systems are stand-alone AOI systems for high volume inspection of all PCB types designed to operate in inspectify mode of operation. Inspectify is a mode of operation enabling the operator to perform verification immediately after inspection on the same system, thus saving time and eliminating handling-related defects.
LAM is specially designed for main-stream LAM inspection. It offers unparalleled detection ability on LAM with down to 25 (microns) line/space width technology. The LAM incorporates advanced technology innovations to ensure the level of detection that these masks require at this critical production stage. Camtek offers! various ! stand-alone verification systems that enable verification of panels after inspection. The Pegasus line includes systems for automated inspection of finished IC substrates that are subsequently used in packaging of ball grid array (BGA) and Chip Scale Package (CSP) devices. The Pegasus inspects both sides of the substrate, detecting process and mechanical defects, in particular in the gold-plated areas, where the substrate will interconnect with the silicon die or the PCB, and in the solder-mask areas. Pegasus models handle substrates in strip format in magazines.
GreenJet is a SM digital printing system aimed to replace the conventional SM application lines for prototypes and high mix low volume production. The GreenJet system offers manufacturers flexible and digital SM printing technology solution. The LGP system incorporates PCB digital legend printing technologies with specially developed heat curable ink, resulting in output and system performance. Camtek has developed the inks for both LGP and GreenJet, which involves different chemicals mixed together in order to reach the required ink characterization.
The Company competes with Rudolph Technologies Inc., KLA-Tencor Corporation, Topcon Corporation, Toray Industries, Inc., Hitachi Ltd., Nidec Tosok Corporation., FEI Company, SII Nanotechnology Japan, Carl Zeiss, Inc., Orbotech Ltd., Dainippon Screen Manufacturing Company, Lloyd-Doyle Limited, Gigavis Co. Ltd., ATI Electronics Pty Ltd., Shirai Electronics Industrial Co. Ltd., First EIE SA and MicroCraft K.K.
Advisors' Opinion:- [By Paul Ausick]
Stocks on the Move: Ingersoll-Rand is down 22.2% at $55.54 after completing a spin-off of Allegion plc. Canadian National Railway Co. (NYSE: CNI) is down 48.6% at $57.78 following a 2-for-1 stock split. Camtek Ltd. (NASDAQ: CAMT) is up 38.9% at $5.71.
- [By Paul Ausick]
Shares of tech industry testing and inspection systems maker Camtek Ltd. (NASDAQ: CAMT) closed at $1.89 on November 7th, the day the company announced third-quarter earnings. It closed at $2.65 last Friday and skyrocketed to a high of $6.43 on Tuesday before dropping back to around $4.00 in Wednesday trading.
- [By James E. Brumley]
It took about three nanoseconds for the market to fall in love with Camtek LTD (NASDAQ:CAMT) a couple of days ago after it announced it would soon be introducing a 3D printer that could print circuit boards; the mere mention of the term "3d printers" is enough to incite bullish hysteria. And, it only took another three nanoseconds for the market to begin comparing CAMT to VJET... the ticker symbol for the equally-obscure (until recently anyway) 3D printer company called Voxeljet AG (NYSE:VJET). Indeed, Camtek LTD was posed as "the next Voxeljet AG", which is nothing less than amazing because nobody is all that clear yet on what the real Voxeljet is. But, just for the record, enthusiasts and shareholders better hope CAMT isn't following in the footsteps of VJET, as the rug got pulled out from underneath Voxeljet AG a few days ago, shocking anyone and everyone who drank the Kool-Aid.
- [By Eddie Staley]
In trading on Tuesday, technology shares were relative laggards, down on the day by about 1.68 percent. Top decliners in the sector included Camtek (NASDAQ: CAMT), down 15.54 percent, and MakeMyTrip (NASDAQ: MMYT), off 11.85 percent.
Best Semiconductor Stocks To Buy For 2014: USmart Mobile Device Inc (UMDI)
USmart Mobile Device Inc., formerly ACL Semiconductors Inc., incorporated on September 17, 2002, the Company is engaged primarily in the business of distributing memory products under the Samsung brand name, which consists of Dynamic Random Access Memory (DRAM), Graphic Random Access Memory (Graphic RAM) and Flash for the Hong Kong and Southern China markets. The primary products the Company distributes and sells include Synchronous Dynamic Random Access Memory (SDRAMs), DDRs (DDR1, DDR2 and DDR3), Flash memory, Graphic RAM and LCD panels. In September 2012, the Company acquired Jussey Investments Limited.
Synchronous Dynamic Random Access Memory (SDRAMs), or mobile SDRAM, are used semiconductor memory component in computer peripherals, such as Hard Disk Drives (HDD), Digital Still Camera (DSC), Modems, ADSL Applications, DVD player, Set-top Box (STB), Digital TV, High Definition TV (HDTV) and Portable Multimedia Players (PMP). DDRs (DDR1, DDR2 and DDR3) are random access memory components that transfer data on both 0-1 and 1-0 clock transitions, theoretically yielding twice the data transfer rate of normal RAM or SDRAM.
Flash memory is a specialized type of memory component used to store user data and program code; it retains this information even when the power is off. Although Flash is predominantly used in mobile phones and tablets, it is commonly used in multi-media digital storage applications for products, such as moving picture experts group layer-3 audio (MP3) players, digital still camera DSC, Digital Voice Recorders, universal serial bus (USB) Disks and Flash Cards. Graphic RAM is a special purpose DDR (GDDR1, GDDR2, GDDR3, GDDR4) that is used in graphic products which require high-speed 3-dimensional calculation performance and a memory size to be used as data storage buffer for digital versatile disc (DVD) and computer game displays. LCD panels are a component in consumer electronics, such as LCD TVs, tablets, smartphones, notebooks, digital phone frames and por! table game consoles.
The Company competes with Toshiba, Hynix, Nanya, PSC, Promos, ISSI and ESMT.
Advisors' Opinion:- [By Peter Graham]
Last Friday, small cap stocks MedCAREERS Group Inc (OTCMKTS: MCGI), USmart Mobile Device Inc (OTCMKTS: UMDI) and Drinks Americas Holdings, Ltd (OTCMKTS: DKAM) were all over the place with the first two sinking 54% and 48.05%, respectively, while the last one rose 10.81%. It should be mentioned that all three small cap stocks have been the subject of paid promotions albeit none of these stocks have been over promoted. So where can investors and traders expect these stocks to head this week? Here is a quick look at what you might expect:
Best Semiconductor Stocks To Buy For 2014: Texas Instruments Incorporated(TXN)
Texas Instruments Incorporated engages in the design and sale of semiconductors to electronics designers and manufacturers worldwide. The company?s Analog segment offers high-performance analog products comprising standard analog semiconductors, such as amplifiers, data converters, and interface semiconductors; high-volume analog and logic products; and power management semiconductors and line-powered systems. Its Embedded Processing segment includes DSPs that perform mathematical computations to process and enhance digital data; and microcontrollers, which are designed to control a set of specific tasks for electronic equipment. The company?s Wireless segment designs, manufactures, and sells application processors and connectivity products. Its Other segment offers smaller semiconductor products, which include DLP products that are primarily used in projectors to create high-definition images; and application-specific integrated circuits. This segment also provides handhe ld graphing and scientific calculators, as well as licenses technologies to other electronic companies. The company serves the communications, computing, industrial, consumer electronics, automotive, and education sectors. Texas Instruments Incorporated sells its products through a direct sales force, distributors, and third-party sales representatives. It has collaboration agreements with PLX Technology Inc.; Neonode, Inc.; and Ubiquisys Ltd. The company was founded in 1938 and is headquartered in Dallas, Texas.
Advisors' Opinion:- [By Dan Caplinger]
Texas Instruments (NASDAQ: TXN ) will release its quarterly report on Monday, and investors have been happy about the company's new strategy, sending the stock to its best levels since the tech boom in 2000. Yet the shrewdness of TI's strategy is that rather than going head-to-head against giants Intel (NASDAQ: INTC ) and Qualcomm (NASDAQ: QCOM ) , Texas Instruments has instead chosen to concentrate on its areas of greatest strength, ceding more competitive business to its rivals rather than fighting it out in a destructive price war.
Best Semiconductor Stocks To Buy For 2014: Malaysian Pacific Industries Bhd (MPI)
Malaysian Pacific Industries Berhad (MPI) is an investment holding company. The principal activities of MPI, through its subsidiaries are manufacturing, assembling, testing and sale of integrated circuits, semiconductor devices, electronic components and lead frames to customers globally. The Company�� operating geographical segments include Asia, The United States of America, and Europe. The Company's subsidiaries include Carsem (M) Sdn Bhd, Recams Sdn Bhd, Carsem Holdings Limited, Carsem Semiconductor (Suzhou) Co., Ltd, Dynacraft Industries Sdn Bhd, Carter Realty Sdn Bhd, Carter Realty Sdn Bhd and Carsem Holdings (HK) Limited. Advisors' Opinion:- [By Sofia Horta e Costa]
Michael Page International Plc (MPI) increased 1.1 percent to 490.2 pence after Goldman Sachs Group Inc. upgraded the stock to buy from neutral, saying the recruitment firm will benefit from a pick-up in the European economy.
Best Semiconductor Stocks To Buy For 2014: Advanced Semiconductor Engineering Inc (ASX)
Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.
The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.
Packaging Services
The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).
The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.
The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.
Testing Services
The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.
The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.
Advisors' Opinion:- [By Namitha Jagadeesh]
The FTSE 100 Index (UKX) fell 1.31 points, less than 0.1 percent, to 6,679.77 at 10:12 a.m. in London, trimming an earlier decline of as much as 0.6 percent. The gauge has climbed 13 percent this year as central banks maintained stimulus measures to support the global economy. The broader FTSE All-Share Index (ASX) was also little changed today, while Ireland�� ISEQ Index retreated 0.3 percent.
- [By Jeff Reeves]
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Best Stocks to Buy for Around $5: Advanced Semiconductor Engineering (ASX)Advanced Semiconductor Engineering�(ASX) builds and distributes integrated circuits and other electronics. While that�� not as sexy as other chipmakers that play to mobile, it�� still a good business, considering the general demand for microchips in everything from cars to computers to TVs.
- [By David Dittman]
Crown Resorts is a buy all the way up to USD16.50 on the Australian Securities Exchange (ASX) using the symbol CWN and on the US over-the-counter (OTC) market using the symbol CWLDF.
- [By Seth Jayson]
Advanced Semiconductor Engineering (NYSE: ASX ) is expected to report Q2 earnings around July 7. Here's what Wall Street wants to see:
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